Display device having notched connection wiring

ABSTRACT

A display device includes a substrate including a display region, a pad region spaced apart from the display region, and a bending region between the display region and the pad region. A plurality of pixel structures is positioned in the display region of the substrate. A plurality of pad wirings is positioned in the pad region of the substrate. A plurality of connection wirings electrically connect the pad wirings to the pixel structures. The connection wirings include a plurality of notches in the bending region.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean patentApplication No. 10-2017-0024982 filed on Feb. 24, 2017, the disclosureof which is incorporated by reference herein in its entirety.

1. Technical Field

Exemplary embodiments of the present invention relate to a displaydevice, and more particularly to a display device having notchedconnection wiring.

2. Discussion of Related Art

A flat panel display (FPD) device may be employed as a display device ofan electronic device. The FPD device may be relatively lightweight andthin with respect to a cathode-ray tube (CRT) display device. Examplesof the FPD device include a liquid crystal display (LCD) device and anorganic light emitting display (OLED) device.

A flexible OLED device capable of bending or folding a portion of theOLED device may include lower and upper substrates, which have flexiblematerials. For example, the lower substrate included in the displaypanel may include a flexible material, and the upper substrate includedin the display panel may have a thin film encapsulation structure.

By bending at least a portion of the substrate, the visibility of thedisplay device can be increased at various angles, or a magnitude ofnon-display region in the display device can be reduced. However,defects such as a short circuit may occur in a manufacturing process ofthe bent/bendable display device.

SUMMARY

An exemplary embodiment of the present invention provides a displaydevice capable of preventing or reducing a short circuit betweenadjacent wirings on the bending region.

According to an exemplary embodiment of the present invention, a displaydevice includes a substrate including a display region, a pad regionspaced apart from the display region, and a bending region between thedisplay region and the pad region. A plurality of pixel structures ispositioned in the display region of the substrate. A plurality of padwirings is positioned in the pad region of the substrate. A plurality ofconnection wirings electrically connect the pad wirings to the pixelstructures. The connection wirings include a plurality of notches in thebending region.

In an exemplary embodiment of the present invention, a first distancebetween two adjacent notches of the plurality of notches may be smallerthan a second distance between two adjacent connection wirings of theplurality of connection wirings.

In an exemplary embodiment of the present invention, each of theconnection wirings may include a plurality of holes in the bendingregion.

In an exemplary embodiment of the present invention, a first length ofthe holes may be smaller than the second distance.

In an exemplary embodiment of the present invention, the connectionwirings may extend in the first direction in the bending region. Theholes may be spaced apart from the notches along a second directionperpendicular to the first direction.

In an exemplary embodiment of the present invention, the notches mayinclude a plurality of first notches positioned at a first side of eachof the connection wirings, and a plurality of second notches positionedat a second side of each of the connection wirings. The second side maybe opposite to the first side.

In an exemplary embodiment of the present invention, the connectionwirings may extend in the first direction in the bending region. Thefirst notches may be spaced apart from the second notches along a seconddirection perpendicular to the first direction.

In an exemplary embodiment of the present invention, the connectionwirings may extend in the first direction in the bending region.Respective first notches of the plurality of first notches may each besubstantially aligned with a corresponding second notch of the pluralityof second notches along the second direction.

In an exemplary embodiment of the present invention, each of the notchesof the plurality of notches may have an uneven shape when viewed from aplan view.

In an exemplary embodiment of the present invention, each of the padwirings may include a plurality of third notches positioned at a firstside of each of the pad wirings, and a plurality of fourth notchespositioned at a second side of each of the pad wirings. The fourth sidemay be opposite to the third side.

In an exemplary embodiment of the present invention, the pad wirings mayextend in a third direction. The third notches of the plurality of thirdnotches may be spaced apart from the fourth notches of the plurality offourth notches along a fourth direction orthogonal to the thirddirection.

In an exemplary embodiment of the present invention, the pad wirings mayextend in a third direction. Respective third notches of the pluralityof third notches may each be substantially aligned with correspondingfourth notches of the plurality of fourth notches along a fourthdirection orthogonal to the third direction.

In an exemplary embodiment of the present invention, each of theconnection wirings may include a first metal layer, and a second metallayer disposed on the first metal layer. The second metal layer mayinclude aluminum (Al). A third metal layer may be disposed on the secondmetal layer.

In an exemplary embodiment of the present invention, the pixelstructures may face away from the plurality of pad wirings when thesubstrate is bent.

In an exemplary embodiment of the present invention, the display devicemay include a protective film positioned under the display region andthe pad region of the substrate. An adhesive layer may be disposedbetween the substrate and the protective film.

In an exemplary embodiment of the present invention, the connectionwirings may be configured to receive at least one of data signals, scansignals, emission control signals, or power voltages via the padwirings.

According to an exemplary embodiment of the present invention, a displaydevice may include a substrate including a display region, a pad regionspaced apart from the display region, and a bending region between thedisplay region and the pad region. A plurality of pixel structures maybe positioned in the display region of the substrate. A driving circuitmay be positioned in the pad region of the substrate. The drivingcircuit may be configured to provide a driving signal to the pixelstructures of the plurality of pixel structures. A plurality ofconnection wirings electrically connect the driving circuit to theplurality of pixel structures. The connection wirings include aplurality of notches in the bending region.

In an exemplary embodiment of the present invention, a first distancebetween two adjacent notches of the plurality of notches may be smallerthan a second distance between two adjacent connection wirings of theplurality of connection wirings.

In an exemplary embodiment of the present invention, each of theconnection wirings may include a plurality of holes in the bendingregion.

In an exemplary embodiment of the present invention, a first length ofthe holes may be smaller than the second distance.

In an exemplary embodiment of the present invention, the notches mayinclude a plurality of first notches positioned at a first side of eachof the connection wirings, and a plurality of second notches positionedat a second side of each of the connection wirings. The second side maybe opposite to the first side.

In an exemplary embodiment of the present invention, the connectionwirings of the plurality of connection wirings may each be connected tothe driving circuit via at least one pad wiring of a plurality of padwirings positioned in the pad region.

In an exemplary embodiment of the present invention, each of the padwirings may include a plurality of third notches positioned at a firstside of each of the pad wirings on the pad region, and a plurality offourth notches positioned at a second side of each of the pad wirings onthe pad region. The fourth side may be opposite to the third side.

According to an exemplary embodiment of the present invention, a displaydevice may include a substrate including a display region and a padregion spaced apart from the display region, a plurality of pixelstructures positioned in the display region of the substrate, aplurality of pad wirings positioned in the pad region of the substrate,the pad wirings including a plurality of first notches, and a pluralityof connection wirings electrically connecting the pad wirings to thepixel structures.

In an exemplary embodiment of the present invention, a first distancebetween two adjacent first notches of the plurality of first notches maybe smaller than a second distance between two adjacent pad wirings ofthe plurality of pad wirings.

In an exemplary embodiment of the present invention, the substrate mayfurther include a bending region between the display region and the padregion. Each of the connection wirings includes a plurality of holes inthe bending region.

In an exemplary embodiment of the present invention, the connectionwirings may include a plurality of second notches in the bending region.

In a display device according to an exemplary embodiment of the presentinvention, notches may be formed in connection wirings on the bendingregion and formed in pad wirings on the pad region, and a distancebetween two adjacent notches may be smaller than a distance between twoadjacent wirings. Thus, the display device according to an exemplaryembodiment of the present invention may reduce or prevent an occurrenceof a short circuit between adjacent wirings in the bending region or thepad region during a manufacturing process. Thus, a manufacturing yieldof the display device may be increased and a manufacturing cost of thedisplay device may be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present invention will become moreapparent by describing in detail exemplary embodiments thereof withreference to the accompanying drawings, in which:

FIG. 1 is exploded plan view illustrating a display device according toan exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating the display device of FIG.1.

FIG. 3 is a cross-sectional view illustrating an example in which thedisplay device of FIG. 1 is bent.

FIG. 4 is an enlarged cross-sectional view illustrating an example ofpart ‘C’ of FIG. 2.

FIG. 5A is an enlarged cross-sectional view illustrating an example ofpart ‘D’ of FIG. 2.

FIG. 5B is an enlarged cross-sectional view illustrating another exampleof part ‘D’ of FIG. 2.

FIG. 6 is an enlarged plan view illustrating an example of part ‘A’ ofFIG. 1.

FIG. 7 is a cross-sectional view cut along a line I-I′ of FIG. 6.

FIGS. 8 through 12 are enlarged plan views illustrating examples of part‘A’ of FIG. 1.

FIGS. 13 through 18 are enlarged plan views illustrating examples ofpart ‘B’ of FIG. 1.

FIGS. 19 through 20 are views for describing an effect of the displaydevice of FIG. 1.

DESCRIPTION OF EMBODIMENTS

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. In thisregard, the exemplary embodiments may have different forms and shouldnot be construed as being limited to the exemplary embodiments of thepresent invention described herein.

Like reference numerals may refer to like elements throughout thespecification and drawings.

FIG. 1 is exploded plan view illustrating a display device according toan exemplary embodiment of the present invention. FIG. 2 is across-sectional view illustrating the display device of FIG. 1. FIG. 3is a cross-sectional view illustrating an example in which the displaydevice of FIG. 1 is bent.

Referring to FIGS. 1 through 3, a display device 1000 may include adisplay panel 100, a driving circuit 300, and a lower structure.

Referring to FIG. 1, the display panel 100 may include a plurality ofpixels PX on a substrate 110. The substrate 110 may include a displayregion DR, a bending region BR, and a pad region NR. The display regionDR may include an active region AA and an outer region AO. The pluralityof pixels PX may be positioned in the active region AA of the displayregion DR. In an exemplary embodiment of the present invention, thepixels PX may include an organic light emitting diode (e.g., a pixelstructure) and may be arranged in the active region AA in a matrix form.An encapsulation structure for the pixels PX may be formed in the outerregion AO of the display region DR. The bending region BR may bepositioned between the display region DR and the pad region NR. Thebending region BR of the substrate 110 may be bendable or bent. In anexemplary embodiment of the present invention, the substrate 110 may beoutwardly bent on an axis with respect to a second direction D2 in thebending region BR such that a light emitting structures 140, such as apixel structure, (see, e.g., FIG. 4) faces outward. Thus, thenon-display region on which an image is not displayed might not bevisible to a user. The pad region NR may be spaced from the displayregion DR. Structures (e.g., pad wirings 190) connecting externaldevices such as the driving circuit 300 may be positioned in the padregion NR. Thus, the pixels PX may receive a driving signal, or a powersupply voltage, which may drive the pixels PX.

The driving circuit 300 may provide the driving signal to the pixels PXvia connection wirings 180 and the pad wirings 190. Here, the drivingsignal may include a scan signal, a data signal, and/or an emissioncontrol signal, which may drive the pixel PX. In an exemplary embodimentof the present invention, the driver circuit 300 may be disposeddirectly on the substrate 110 in the pad region NR in a chip-on-plastic(COP) manner. For example, the driving circuit 300 may be mounted on thepad wiring 190 using an anisotropic conductive film (ACF).

The connection wiring 180 may electrically connect the driving circuit300 to the pixel PX (or the pixel structure). The connection wiring 180may include notches in the bending region BR and/or the pad region NR.For example, each of the notches may have an uneven shape such as atriangular shape, a rectangular shape, or a semicircular shape whenviewed from a plan view. Thus, the length of a straight portion of theconnection wiring 180 may be shortened, thus reducing or preventing anoccurrence of a short circuit between adjacent wirings in the bendingregion BR and/or the pad region NR.

In an exemplary embodiment of the present invention, each of theconnection wirings 180 may include a plurality of first notchespositioned at a first side of each connection wiring 180 in the bendingregion BR and/or the pad region NR and a plurality of second notchespositioned at a second side of each connection wiring 180. The secondside may be opposite to the first side. The connection wiring 180 mayinclude a plurality of holes on the bending region BR. For example, theholes of the connection wiring 180 may penetrate the connection wiring180 in a vertical direction (e.g., a third direction D3 orthogonal to afirst direction D1 and a second direction D2). Both of a distancebetween two adjacent first notches (e.g., an interval between the firstnotches) and a distance between two adjacent second notches (e.g., aninterval between the second notches) may be smaller than a distancebetween two adjacent connection wirings 180 (e.g., an interval betweenthe connection wirings 180), thus reducing or eliminating an occurrenceof a short circuit between adjacent connection wirings 180. The shapeand arrangement of the notches of the connection wiring 180 formed inthe bending region BR and/or the pad region NR will be described in moredetail below with reference to FIGS. 6 through 12.

In an exemplary embodiment of the present invention, each of the padwirings 190 may include a plurality of third notches positioned at afirst side of each pad wiring 190 and a plurality of fourth notchespositioned at a second side of each pad wiring 190 in the pad region NR.The second side may be opposite to the first side. For example, each ofthe third and fourth notches may have an uneven shape such as atriangular shape, a rectangular shape, or a semicircular shape whenviewed from a plan view. A distance between two adjacent third notches(e.g., and interval between the third notches) and a distance betweentwo adjacent fourth notches (e.g., and interval between the fourthnotches) may be shorter than a distance between two adjacent pad wirings190 (e.g., and interval between the pad wirings 190), thus reducing oreliminating an occurrence of a short circuit between adjacent padwirings 190. The shape and arrangement of the notches of the pad wiring190 will be described in more detail below with reference to FIGS. 13through 18.

Referring to FIG. 2, the display device 1000 may include the lowerstructure under the display panel 100. The lower structure may include afirst adhesive layer 410, a protective film 420, a second adhesive layer430, a heat sink plate 440, and/or a third adhesive layer 450.

The protective film 420 may include a first protective film pattern 421and a second protective film pattern 422. The first protective filmpattern 421 may be positioned in the display region DR, and the secondprotective film pattern 422 may be positioned in the pad region NR.Thus, the bottom surface of the display panel 100 corresponding to thebending region BR may be exposed. The protective film 420 may includepolyethylene terephthalate (PET), polyethylene naphthalate (PEN), orpolypropylene (PP).

The first adhesive layer 410 may be disposed between the protective film420 and the display panel 100 and may adhere the protective film 420 tothe display panel 100. The first adhesive layer 410 may include a firstadhesive layer pattern 411 overlapping the first protective film pattern421 and a second adhesive layer pattern 412 overlapping the secondprotective film pattern 422 along the third direction D3. The firstadhesive layer 410 may be in direct contact with the bottom surface ofthe display panel 100. The first adhesive layer 410 may include anacryl-based adhesive, a silicone-based adhesive, or a urethane-basedadhesive.

The heat sink plate 440 may be positioned below the bottom surface ofthe protective film 420. The second adhesive layer 430 may be disposedbetween the protective film 420 and the heat sink plate 440 and mayadhere the heat sink 440 to the protective film 420. The heat sink plate440 may be disposed under the display panel 100 and may absorb heatgenerated from the display panel 100. When the heat generated from thedisplay panel 100 is not absorbed, the performance of the display panel100 may be reduced and the lifespan of the pixels PX may be shortened.The heat sink plate 440 may include a material having relatively highthermal conductivity.

Referring to FIG. 3, as the bending region BR is bent, the pad region NRcan be positioned at a rear of the display device 1000. In an exemplaryembodiment of the present invention, the bending region BR may be benton an axis with respect to the second direction D2, and the secondprotective film pattern 422 may be positioned below a bottom surface ofthe heat sink plate 440. After the bending region BR is bent, the thirdadhesive layer 450 may be positioned between the second protective filmpattern 422 and the heat sink plate 440. In this case, the secondprotective film pattern 422 and the heat sink 440 may be fixed by thethird adhesive layer 450. In addition, the third adhesive layer 450 mayabsorb external impacts. As an example, the third adhesive layer 450 mayinclude urethane, or rubber.

FIG. 4 is an enlarged cross-sectional view illustrating an example ofpart ‘C’ of FIG. 2. FIG. 5A is an enlarged cross-sectional viewillustrating an example of part ‘D’ of FIG. 2.

Referring to FIGS. 4 and 5A, the display panel 100 may include thesubstrate 110, a semiconductor element 120, a first conductive pattern128, a second conductive pattern 129, a planarization layer 130, a lightemitting structure 140, a pixel defining layer 150, a thin filmencapsulation (TFE) structure 170, and a connection wiring 180. Thedisplay panel 100 may be a flexible display panel including the flexiblesubstrate 110 and the TFE structure 170.

Referring to FIG. 4, the substrate 110 may include a flexibletransparent material such as a flexible transparent resin substrate(e.g., a polyimide substrate). For example, the polyimide substrate mayinclude a first polyimide layer, a first barrier film layer, a secondpolyimide layer, and a second barrier film layer. Since the polyimidesubstrate is relatively thin and flexible, the polyimide substrate maybe disposed on a rigid glass substrate to help support the formation ofthe semiconductor element 120 and the light emitting structure (e.g., alower electrode 141, a light emitting layer 142, and an upper electrode143, etc). Thus, the substrate 110 may have a structure in which thefirst polyimide layer, the first barrier film layer, the secondpolyimide layer, and the second barrier film layer are stackedsequentially on the rigid glass substrate. For example, after aninsulating layer (e.g., a buffer layer) is formed on the second barrierlayer, the semiconductor element 120 and the light emitting structure140 may be disposed on the insulating layer. After the semiconductorelement 120 and the light emitting structure 140 are formed on theinsulating layer, the rigid glass substrate on which the polyimidesubstrate is disposed may be removed.

A buffer layer may be disposed on the substrate 110. The buffer layermay be disposed on substantially the entire substrate 110. The bufferlayer may reduce or prevent a diffusion of metal atoms and/or impuritiesfrom the substrate 110 into the semiconductor element 120. Additionally,the buffer layer may control a rate of a heat transfer in acrystallization process for forming the active layer 121, thus obtainingsubstantially uniform the active layer 121. The buffer layer mayincrease a surface flatness of the substrate 110 when a surface of thesubstrate 110 is relatively irregular. According to a type of thesubstrate 110, at least two buffer layers may be provided on thesubstrate 110, or the buffer layer may be omitted. For example, thebuffer layer may include a silicon compound, or a metal oxide.

The semiconductor element 120 may be disposed on the substrate 110. Thesemiconductor element 120 may include an active layer 121, gateinsulation layer 122, a gate electrode 123, an insulating interlayer124, a source electrode 125 and a drain electrode 126.

The active layer 121 may be disposed on the substrate 110. The activelayer 121 may include an oxide semiconductor, an inorganic semiconductor(e.g., amorphous silicon, polysilicon, etc.), or an organicsemiconductor.

The gate insulation layer 122 may be disposed on the active layer 121.The gate insulation layer 122 may substantially cover the active layer121, and may be disposed on the substrate 110. For example, the gateinsulation layer 122 may at least partially cover the active layer 121on the substrate 110, and may have a substantially level surface withouta step around the active layer 121. Alternatively, the gate insulationlayer 122 may substantially cover the active layer 121 on the substrate110, and may be disposed as a substantially uniform thickness along aprofile of the active layer 121. In an exemplary embodiment of thepresent invention, the gate insulation layer 122 may expose an uppersurface of the substrate 110 that is located in a portion of the bendingregion BR and the pad region NR. The gate insulation layer 122 mayinclude a silicon compound, or a metal oxide.

The gate electrode 123 may be disposed on a portion of the gateinsulation layer 122 under which the active layer 121 is positioned. Thegate electrode 123 may include a metal, a metal alloy, metal nitride,conductive metal oxide, or transparent conductive materials.

The insulating interlayer 124 may be disposed on the gate electrode 123.The insulating interlayer 124 may substantially cover the gate electrode123, and may be disposed on the gate insulation layer 122. For example,the insulating interlayer 124 may at least partially cover the gateelectrode 123 on the gate insulation layer 122, and may have asubstantially level surface without a step around the gate electrode123. Alternatively, the insulating interlayer 124 may cover the gateelectrode 123 on the gate insulation layer 122, and may be disposed as asubstantially uniform thickness along a profile of the gate electrode123. In an exemplary embodiment of the present invention, the insulatinginterlayer 124 may expose an upper surface of the substrate 110 that islocated in a portion of the bending region BR and the pad region NR. Theinsulating interlayer 124 may include a silicon compound, or a metaloxide.

The source electrode 125 and the drain electrode 126 may be disposed onthe insulating interlayer 124. The source electrode 125 may be in directcontact with a first side of the active layer 121 via a contact holeformed by removing a portion of the gate insulation layer 122 and theinsulating interlayer 124. The drain electrode 126 may be in directcontact with a second side of the active layer 121 via a contact holeformed by removing another portion of the gate insulation layer 122 andthe insulating interlayer 124. Each of the source electrode 125 and thedrain electrode 126 may include a metal, an alloy, a metal nitride, aconductive metal oxide, or one or more transparent conductive materials.These may be used alone or in a suitable combination thereof. In anexemplary embodiment of the present invention, each of the source anddrain electrodes 125 and 126 may have a multi-layered structure.

Referring to FIG. 5A, the driving circuit (or the external device) mayprovide the data signal, the scan signal, the emission control signal,or the power voltage to the pixels via the pad wiring 190, the secondconductive pattern 129, the connection wiring 180, and the firstconductive pattern 128.

The first conductive pattern 128 may be positioned in the edge of thedisplay region DR (e.g., the outer region AO described in FIG. 1) on thegate insulation layer 122. The first conductive pattern 128 may be oneamong a plurality of the lines connected to the pixels. For example, thefirst conductive pattern 128 may be one of a data signal line, a scansignal line, an emission control signal line, pr a power supply line.

The second conductive pattern 129 may be positioned in the pad region NRon the gate insulation layer 122. The second conductive pattern 129 maybe electrically connected to the pad wiring 190.

The connection wiring 180 may be disposed on the substrate 110 in thebending region BR, and may be disposed on the insulating interlayer 124in the edge of the display region DR and the portion of the pad regionNR. The connection wiring 180 may be in direct contact with the firstconductive pattern 128 via a contact hole formed by removing a portionof the insulating interlayer 124 positioned in the edge of the displayregion DR, and may be in direct contact with the second conductivepattern 129 via a contact hole formed by removing a portion of theinsulating interlayer 124 positioned in the pad region NR. Theplanarization layer 130 may be disposed on the connection wiring 180.

The pad wiring 190 may be disposed on the insulating interlayer 124 inthe pad region NR. The pad wiring 190 may be in direct contact with thesecond conductive pattern 129 via a contact hole formed by removing aportion of the insulating interlayer 124 located in the pad region NR.

In an exemplary embodiment of the present invention, the firstconductive pattern 128, the second conductive pattern 129, and the gateelectrode 123 may be substantially simultaneously formed using a samematerial. The connection wiring 180, the pad wiring 190, the sourceelectrode 125, and the drain electrode 126 may be substantiallysimultaneously formed using a same material.

In an exemplary embodiment of the present invention, the connectionwiring 180 and the pad wiring 190 may have a multi-layered structureincluding aluminum (Al) layer. For example, the connection wiring 180and the pad wiring 190 may have a triple-layered structure includingtitanium/aluminum/titanium (Ti/Al/Ti) layers. In this case, a titanium(Ti) layer positioned at the uppermost layer may be damaged duringetching and cleaning processes. A short circuit between the connectionwirings 180 or between the pad wirings 190 may occur through aninteraction of particles of the connection wiring 180 or particles ofthe pad wiring 190 (e.g., titanium particles). Thus, the connectionwirings 180 and the pad wirings 190 may include notches to prevent arelatively long arrangement of particles in a straight line. Inaddition, the connection wiring 180 may include the plurality of holeson the bending region BR to have a high flexibility. The plurality ofholes may further prevent a relatively long arrangement of particles ina straight line.

Thus, the driving circuit (or the external device) may be electricallyconnected to the pad wiring 190, and may provide the data signal, thescan signal, the emission control signal, or the power supply voltage tothe pixels via the pad wiring 190, the second conductive pattern 129,the connection wiring 180, and the first conductive pattern 128.

Referring again to FIG. 4, the planarization layer 130 may be disposedon the source electrode 125 and the drain electrode 126. Theplanarization layer 130 may substantially cover the source electrode 125and the drain electrode 126. In an exemplary embodiment of the presentinvention, the planarization layer 130 may be relatively thick and mayat least partially cover the source and drain electrodes 125 and 126. Inthis case, the planarization layer 130 may have a substantially flatupper surface, and a planarization process may be further performed onthe planarization layer 130 to implement the flat upper surface of theplanarization layer 130.

Alternatively, the planarization layer 130 may substantially cover thesource and drain electrodes 125 and 126, and may be disposed as asubstantially uniform thickness along a profile of the source and drainelectrodes 125 and 126. The planarization layer 130 may include organicmaterials or inorganic materials.

The lower electrode 141 may be disposed on the planarization layer 130.The lower electrode 141 may be in direct contact with the drainelectrode 126 via a contact hole formed by removing a portion of theplanarization layer 130. The lower electrode 141 may be electricallyconnected to the semiconductor element 120. The lower electrode 141 mayinclude a metal, a metal alloy, a metal nitride, a conductive metaloxide, or one or more transparent conductive materials. These may beused alone or in a suitable combination thereof. In an exemplaryembodiment of the present invention, the lower electrode 141 may have amulti-layered structure.

The pixel defining layer 150 may be disposed on the planarization layer130, and may expose a portion of the lower electrode 141. The lightemitting layer 142 may be disposed on the portion of the lower electrode141 exposed by the pixel defining layer 150. In an exemplary embodimentof the present invention, the pixel defining layer 150 may expose thebending region BR and the pad region NR. The pixel defining layer 150may include organic materials or inorganic materials.

The light emitting layer 142 may be disposed on a portion where theportion of the lower electrode 141 is exposed. The light emitting layer142 may be formed using at least one of light emitting materials capableof generating different colors of light (e.g., a red color of light, ablue color of light, or a green color of light) according to sub-pixels.Alternatively, the light emitting layer 142 may generate a white colorof light by stacking a plurality of light emitting materials capable ofgenerating different colors of light such as a red color of light, agreen color of light, and a blue color of light. In this case, a colorfilter may be disposed on the light emitting layer 142.

The upper electrode 143 may be disposed on the pixel defining layer 150and the light emitting layer 142. The upper electrode 143 may include ametal, a metal alloy, a metal nitride, a conductive metal oxide, or oneor more transparent conductive materials.

The TFE structure 170 may be disposed on the upper electrode 143. TheTFE structure 170 may include a first TFE layer 171, a second TFE layer172, and a third TFE layer 173. For example, the first TFE layer 171 maybe disposed on the upper electrode 143. The first TFE layer 171 maysubstantially cover the upper electrode 143, and may be disposed as asubstantially uniform thickness along a profile of the upper electrode143. The first TFE layer 171 may reduce or prevent the light emittingstructure 140 from being deteriorated by the permeation of moisture,water, or oxygen. In addition, the first TFE layer 171 may protect thelight emitting structure 140 from external impacts. The first TFE layer171 may include one or more inorganic materials. The second TFE layer172 may be disposed on the first TFE layer 171. The second TFE layer 172may increase the flatness of the display device 100, and may protect thelight emitting structure 140. The second TFE layer 172 may include oneor more organic materials. The third TFE layer 173 may be disposed onthe second TFE layer 172. The third TFE layer 173 may substantiallycover the second TFE layer 172, and may be disposed as a substantiallyuniform thickness along a profile of the second TFE layer 172. The thirdTFE layer 173 together with the first TFE layer 171 and the second TFElayer 172 may prevent the light emitting structure 140 from beingdeteriorated by the permeation of moisture, water, or oxygen. Inaddition, the third TFE layer 173 together with the first TFE layer 171and the second TFE layer 172 may protect the light emitting structure140 from external impacts. The third TFE layer 173 may include one ormore inorganic materials.

Referring to FIG. 4, according to an exemplary embodiment of the presentinvention, the semiconductor element 120 may have a top gate structure.However, the structure of the semiconductor element 120 is not limitedthereto. For example, the semiconductor element may have a bottom gatestructure.

Referring to FIG. 4, according to an exemplary embodiment of the presentinvention, the TFE structure may have a triple-layered structure.However, the structure of the TFE structure is not limited thereto. Forexample, the TFE structure may have 5-layered structure including thefirst through fifth TFE layers or 7-layered structure including thefirst through seventh TFE layers.

FIG. 5B is an enlarged cross-sectional view illustrating another exampleof part ‘D’ of FIG. 2.

Referring to FIGS. 4 and 5B, the driving circuit (or the externaldevice) may provide the data signal, the scan signal, the emissioncontrol signal, or the power voltage to the pixels via the secondconductive pattern 129, the connection wiring 180, and the firstconductive pattern 128. The connection structure of the display deviceaccording to an exemplary embodiment of the present invention describedwith reference to FIG. 5B may be substantially the same as theconnection structure of the exemplary embodiment described whereinreference to FIG. 5A, except that a first insulation layer 127 may bepositioned between the substrate 110 and the connection wiring 180 onthe bending region BR. Thus, the same reference numerals may be used torefer to the same or like parts as those described with reference toFIG. 5A, and duplicative descriptions may be omitted.

The first insulation layer 127 may be disposed on the substrate 110 inthe bending region BR. The first conductive pattern 128 may be disposedon the first insulation layer 127 in the bending region BR.

In an exemplary embodiment of the present invention, the firstinsulation layer 127 may have a substantially level upper surface, and aplanarization process may be further performed on the first insulationlayer 127 to implement the level surface of the first insulation layer127. For example, the thickness of the first insulating layer 127 may beadjusted such that the neutral plane in the bending region BR is locatedat a position in which the connection wiring 180 is located. Thus, anoccurrence of damage to the connection wiring 180 may be reduced oreliminated and the durability of the connection wiring 180 may beincreased.

In an exemplary embodiment of the present invention, the firstinsulation layer 127 may have an uneven surface on at least a portion ofthe upper surface. Thus, the connection wiring 180 disposed on the firstinsulation layer 127 may have upper and/or lower surface correspondingto the uneven surface of the first insulating layer 127. Tensile stressmay be applied to the connection wiring 180 in the bending region BR asthe substrate 110 is bent in the bending region BR. The amount oftensile stress applied to the connection wiring 180 may be reduced whenthe connection wiring 180 has the uneven upper and/or lower surfacescorresponding to the uneven surface of the layer 127. As an example, thetensile stress occurred by bending of the display panel can be reducedby deforming the shape of the first insulating layer 127 having arelatively low strength. The connection wiring 180 may have an unevensurface before the substrate is bent, and the connection wiring 180 mayhave a shape corresponding to the first insulating layer 127 of whichshape is deformed by the bending after the substrate is bent. Thus, anoccurrence of a short circuit in the connection wiring 180 may bereduced or eliminated.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 5A and 5B describe that the pixels and thedriving circuit (or, the external devices) are electrically connectedthrough the first conductive pattern 128 and the second conductivepattern 129, exemplary embodiments of the present invention are notlimited thereto. For example, the driving circuit (or the externaldevice) may be electrically connected to the connection wiring throughthe pad wiring directly in direct contact with the connection wiring.Each of the connection wirings may be directly connected to one of thescan signal lines, the data signal lines, the emission control signallines, or the power supply lines.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 5A and 5B describe that the planarization layer130 substantially covers the connection wiring 180 in the bending regionBR and the pad region NR, exemplary embodiments of the present inventionare not limited thereto. The connection wiring 180 may be exposed or theconnection wiring 180 may be substantially covered by at least one ofthe planarization layer 130, the pixel defining layer 150, or a bendingprotection layer. For example, the bending protection layer may bedisposed on the planarization layer 130 in a portion of the bendingregion BR and the pad region NR. Thus, the thickness of the bendingprotection layer can be determined such that the neutral plane in thebending region BR is positioned at the portion where the connectionwirings 180 are disposed. For example, when the neutral plane of thebending region BR is located at the portion where the connection wirings180 are disposed, the bending stress applied to the connection wirings180 by bending the bending region BR may be reduced. Thus, theconnection wirings 180 might not be broken.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 5A and 5B describe that the connection wiring180 includes notches in the bending region BR and/or the pad region NR,the connection wiring 180 may also include notches in the display regionDR. For example, the connection wiring 180 may include notches in thedisplay region DR and the pad region NR, and may include both holes andnotches in the bending region BR.

FIG. 6 is an enlarged plan view illustrating an example of part ‘A’ ofFIG. 1. FIG. 7 is a cross-sectional view cut along a line I-I′ of FIG.6.

Referring to FIGS. 6 and 7, each of connection wirings 180A-1, 180B-1may include holes HL-1 and notches NT-1 on at least a portion A-1 of thebending region, thus reducing or preventing an occurrence of a shortcircuit between adjacent wirings the bending region BR during amanufacturing process.

Referring to FIG. 7, each of the connection wirings 180A-1, 180B-1 mayinclude a first metal layer 181, a second metal layer 182, and a thirdmetal layer 183. For example, the first metal layer 181, the secondmetal layer 182 and the third metal layer 183 may have a triple-layeredstructure including titanium/aluminum/titanium (Ti/Al/Ti) layers orincluding molybdenum/aluminum/molybdenum (Mo/AL/Mo). In this case,because the connection wirings 180A-1, 180B-1 may be formed by a dryetching process with high precision, the interval between the connectionwirings can be shortened. Thus, it is possible to arrange a relativelylarge number of wirings in a relatively narrow space, and a highresolution display device can be implemented.

In this case, the third metal layer 183 including titanium (Ti) ormolybdenum (Mo) may be damaged during the manufacturing process due tothe etching process, the cleaning process, or other impacts. Forexample, when the driving circuit is mounted in the COP manner, theconnection wirings 180A-1, 180B-1 in the bending area BR may be exposedwithout capping to prevent contact lifting. Thus, the short circuitbetween adjacent connection wirings 180A-1, 180B-1 may occur as a resultof interaction between particles (for example, titanium (Ti) particles)of adjacent connection wirings 180A-1, 180B-1. Thus, each of theconnection wirings 180A-1, 180B-1 may include notches NT-1 to avoidrelatively long arrangements of particles in a straight line.

Referring to FIG. 6, each of the connection wirings 180A-1, 180B-1 mayinclude notches NT-1 at the first side and the second side opposite thefirst side in the bending region BR. In an exemplary embodiment of thepresent invention, the notches NT-1 may be arranged at regular intervalsalong the first direction D1. A first distance D1-1 between the twoadjacent notches NT-1 may be smaller than the second distance D2-1between the two adjacent connection wirings 180A-1, 180B-1. Here, thefirst distance D1-1 indicates a length of the straight portion of theconnection wiring, the straight portion defined by the notch NT-1. Thesecond distance D2-1 indicates the shortest distance between the twoadjacent connection wirings 180A-1, 180B-1. Thus, the notches NT-1 maybe formed such that the first distance D1-1 between the notches NT-1 isrelatively short compared to the second distance D2-1 between theconnection wirings 180A-1, 180B-1. Thus, relatively long and straightarrangements of particles might not be generated because the connectionwirings 180A-1, 180B-1 extending in the first direction D1 do not have along straight-line shape on the bending region BR.

Each of the connection wirings 180A-1 and 180B-1 may include holes HL-1in the bending region BR, which may increase the flexibility. The holesHL-1 may penetrate the connection wiring in the vertical direction(e.g., a third direction D3), and may be arranged at regular intervalswith respect to the first direction D1. In an exemplary embodiment ofthe present invention, a first size S1 (or a first length) of each ofthe holes HL-1 may be smaller than the second distance D2-1. Here, thefirst size S1 of the hole HL-1 indicates the longest length of the holein the plane view. In an exemplary embodiment of the present invention,the holes HL-1 may have a substantially circular shape, and the firstsize S1 of the holes HL-1 may correspond to the diameter of the holesHL-1. In an exemplary embodiment of the present invention, the holesHL-1 may have an elliptical shape, and the first size S1 of the holesHL-1 may correspond to the long diameter of the holes HL-1. In anexemplary embodiment of the present invention, the holes HL-1 have apolygonal shape, and the first size S1 of the holes HL-1 may correspondto the longest one of the diagonal lines of the polygon. Thus, anoccurrence of a short circuit between the connection wirings 180A-1 and180B-1 as a result of particles generated in the process of forming theholes can be prevented.

Although the exemplary embodiments of the present invention describedwith reference to FIG. 7 describe that each of the connection wirings180A-1, 180B-1 has a triple-layered structure, a structure of theconnection wiring is not limited thereto. For example, each of theconnection wirings may have a single-layered structure or amulti-layered structure, which may include at least one of aluminum(Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold(Au), nickel (Ni), neodymium (Nd), iridium (Ir), chrome (Cr), nickel(Ni), molybdenum (Mo), titanium (Ti), tungsten (W), or copper (Cu).

FIGS. 8 through 12 are enlarged plan views illustrating examples of part‘A’ of FIG. 1.

Referring to FIGS. 8 through 12, holes and notches of connection wiringson the bending region may be formed in various ways according tocharacteristics and arrangements of the connection wirings.

Referring to FIG. 8, each of connection wirings 180A-2, 180B-2 mayinclude holes HL-2 having an elliptical shape and notches NT-2 having asemicircular shape in at least portion A-2 of the bending region. Thenotches NT-2 may be arranged at regular intervals along the firstdirection D1. A first distance D1-2 between two adjacent notches NT-2may be smaller than the second distance D2-2 between two adjacentconnection wirings 180A-2, 180B-2. The holes HL-2 may be positioned atapproximately the center of the connection wiring with respect to thesecond direction D2 in a plan view. The holes HL-2 may penetrate theconnection wiring in the vertical direction (e.g., the third directionD3) and may be arranged at regular intervals with respect to the firstdirection D1. The size (e.g., length or diameter) of the hole HL-2 maybe smaller than a second distance D2-2.

As an example, in case that the line width of the connection wiring180A-2, 180B-2 is decreased by the notch NT-2, a resistance of theconnection wiring 180A-2, 180B-2 may be increased. The resistance of theconnection wirings 180A-2, 180B-2 may be increased when the line widthis relatively uneven in comparison with the case in which the line widthis relatively even. Thus, to increase the uniformity of the line widthdetermined by the holes HL-2 and notches NT-2 and to decrease thedeclined degree of the line width determined by the notch NT-2, thenotches NT-2 may have a semicircular shape, and the notches NT-2 and theholes HL-2 may be alternately arranged along the first direction D1.Thus, the resistance of the connection wiring 180A-2, 180B-2 might notbe increased, and the efficiency of electrical signal transmission maybe increased.

Referring to FIG. 9, each of connection wirings 180A-3, 180B-3 mayinclude holes HL-3 having an elliptical shape and notches NT-3 having asubstantially rectangular shape in at least portion A-3 of the bendingregion. The notches NT-3 may be arranged at regular intervals along thefirst direction D1. A first distance D1-3 between two adjacent notchesNT-3 may be smaller than a second distance D2-3 between two adjacentconnection wirings 180A-3, 180B-3. The holes HL-3 may be positioned atapproximately the center of the connection wiring with respect to thesecond direction D2 in a plan view. The holes HL-3 may penetrate theconnection wiring in the vertical direction (e.g., the third directionD3) and may be arranged at regular intervals along the first direction D1. The size (e.g., length or diameter) of the hole HL-3 may be smallerthan the second distance D2-3.

As an example, a resistance of the connection wiring 180A-3, 180B-3 maybe decreased by positioning the notch NT-3 relatively far from the holeHL-3. Thus, the connection wiring 180A-3, 180B-3 in the bending regionBR may extend in the first direction D1, and then the holes HL-3 neednot overlap the notches NT-3 having a substantially rectangular shapewith respect to the second direction D2 perpendicular to the firstdirection D1 in the plan view. Thus, the minimum distance between thenotch NT-3 and the hole HL-3 may be formed without a portion in whichthe line width is narrowed, Thus decreasing the resistance of theconnection wirings 180A-3 180B-3. Thus, to increase the uniformity ofthe line width determined by the holes HL-3 and notches NT-3 and todecrease the declined degree of the line width determined by the notchNT-3, the notches NT-3 may have the substantially rectangular shape, andthe notches NT-3 and the holes HL-3 may be alternately arranged alongthe first direction D1. Thus, the resistance of the connection wiring180A-3, 180B-3 might not be increased, and the efficiency of electricalsignal transmission may be increased.

Referring to FIG. 10, each of connection wirings 180A-4, 180B-4 mayinclude holes HL-4 having an elliptical shape and notches NT-4 having atrapezoidal shape in at least portion A-4 of the bending region. Thenotches NT-4 may be arranged at regular intervals along the firstdirection D1. A first distance D1-4 between two adjacent notches NT-4may be smaller than a second distance D2-4 between two adjacentconnection wirings 180A-4, 180B-4. The holes HL-4 may be positioned atsubstantially the center of the connection wiring with respect to thesecond direction D2 in a plan view. The holes HL-4 may penetrate theconnection wiring in the vertical direction (e.g., the third directionD3) and may be arranged at regular intervals along the first directionD1. The size (e.g., length or diameter) of the hole HL-4 may be smallerthan the second distance D2-4.

To increase the uniformity of the line width determined according to theholes HL-4 and notches NT-4 and to decrease the declined degree of theline width according to the notch NT-4, the notches NT-4 may have thetrapezoidal shape, and the notches NT-4 and the holes HL-4 may bealternately arranged along the first direction D1. Thus, the connectionwiring 180A-4, 180B-4 according to an exemplary embodiment of thepresent invention may increase the uniformity of the line width comparedto the connection wiring 180A-3, 180B-3 described with reference to FIG.9 including the notches NT-3 having the substantially rectangular shapebecause the connection wiring 180A-4, 180B-4 on the bending region BRincludes the notches NT-4 having the trapezoidal shape. In addition, theconnection wiring 180A-4, 180B-4 in the bending region BR may extend inthe first direction D1, and the holes HL-4 need not overlap the notchesNT-4 having the trapezoidal shape with respect to the second directionD2 perpendicular to the first direction D1 in a plan view.

Referring to FIG. 11, each of connection wirings 180A-5, 180B-5 mayinclude holes HL-5 having an elliptical shape and notches NT-5 having atriangular shape in at least portion A-5 of the bending region. Thenotches NT-5 may be arranged at regular intervals along the firstdirection D1. A first distance D1-5 between two adjacent notches NT-5may be smaller than a second distance D2-5 between two adjacentconnection wirings 180A-5, 180B-5. The holes HL-5 may be positioned atsubstantially the center of the connection wiring with respect to thesecond direction D2 in a plan view. The holes HL-5 may penetrate theconnection wiring in the vertical direction (e.g., the third directionD3) and may be arranged at regular intervals along the first directionD1. The size (e.g., length or diameter) of the hole HL-5 may be smallerthan the second distance D2-5.

The connection wiring 180A-5, 180B-5 according to an exemplaryembodiment of the present invention (e.g., an exemplary embodimentdescribed with reference to FIG. 11) may include notches, which arrangedat relatively short intervals, of which sizes are relatively smallcompared to the connection wiring 180A-1, 180B-1 described withreference to FIG. 6. For example, two notches NT-5 may be arranged onopposite sides of one hole HL-5 along the second direction D2. In thiscase, the efficiency of electrical signal transmission can be increasedbecause the line width may be relatively large.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 6 through 11 describe that notches located atthe first side and notches located at the second side of the connectionwiring on the bending region are substantially symmetrical to each otherwith respect to the first direction in which the connection wiringsextend, the arrangement of the notches is not limited thereto. Forexample, referring to FIG. 12, the connection wirings 180A-6, 180B-6 mayinclude holes HL-6 having the elliptical shape, a plurality of firstnotches NT1-6 located at the first side of the connection wiring, and aplurality of second notches NT2-6 located at the second side of theconnection wiring 180A-6, 180B-6. The first notches NT1-6 need notoverlap the second notches NT2-6 along the second direction D2perpendicular to the first direction D1 in the plan view. A firstdistance D1-6 between two adjacent first notches NT1-6 (or between twoadjacent second notches NT2-6) may be smaller than a second distanceD2-6 between two adjacent connection wirings 180A-6, 180B-6.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 6 through 12 describe that notches have at leastone of the triangular shape, the rectangular shape, the trapezoidalshape, or the semicircular shape in the plan view, the shapes of thenotches are not limited thereto. For example, the notches may have otherpolygonal shapes. For example, the first notches located at the firstside and the second notches located at the second side of the connectionwiring may have different shapes.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 6 through 12 describe that the holes have theelliptical shape on the bending region BR, the shape of the hole is notlimited thereto. For example, the holes may have a substantiallycircular shape or a polygonal shape.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 6 through 12 describe that the holes penetratethe connection wiring, it is not limited thereto. For example, theconnection wiring may include an uneven (e.g., rugged or rough) uppersurface.

FIGS. 13 through 18 are enlarged plan views illustrating examples ofpart ‘B’ of FIG. 1.

Referring to FIGS. 13 through 18, notches of pad wirings on the padregion may be formed in various ways according to characteristics andarrangements of the pad wirings. Thus, because the pad wirings need notbe covered by an organic layer during the manufacturing process, each ofthe pad wirings may include notches on at least a portion of the padregion such that relatively long arrangement of particles in a straightline are not generated during or after a manufacturing process.

Referring to FIG. 13, each of pad wirings 190A-1, 190B-1 may includenotches NO-1 having a triangular shape in at least portion B-2 of thepad region. The notches NO-1 may be arranged at regular intervals alonga fourth direction D4 in which the pad wirings 190A-1, 190B-1 in the padregion NR extend. A third distance D3-1 between two adjacent notchesNO-1 may be smaller than a fourth distance D4-1 between two adjacent padwirings 190A-1, 190B-1.

Referring to FIG. 14, each of pad wirings 190A-2, 190B-2 may includenotches NO-2 having a semicircular shape in at least portion B-2 of thepad region. The notches NO-2 may be arranged at regular intervals alongthe fourth direction D4. A third distance D3-2 between two adjacentnotches NO-2 may be smaller than a fourth distance D4-2 between twoadjacent pad wirings 190A-2, 190B-2.

As an example, when the line width of the pad wiring 190A-2, 190B-2 isdecreased by the notch NO-2, a resistance of the pad wiring 190A-2,190B-2 may be increased. In addition, the resistance of the pad wirings190A-2, 190B-2 may be increased when the line width is relatively unevenin comparison with the case in which the line width is relatively even.Thus, to increase the uniformity of the line width and to decrease thedeclined degree of the line width according to the notch NO-2, thenotches NO-2 may have a semicircular shape. Thus, the efficiency ofelectrical signal transmission may be increased.

Referring to FIGS. 15 and 16, similar to the bending region BR, each ofpad wirings 190A-3, 190B-3 may include notches NO-3 having a rectangularshape in at least portion B-3 of the pad region, or each of the padwirings 190A-4, 190B-4 may include notches NO-4 having a trapezoidalshape in at least portion B-4 of the pad region. A third distance D3-3(or D3-4) between two adjacent notches NO-3 (or NO-4) may be smallerthan a fourth distance D4-3 (or D4-4) between two adjacent pad wirings.

Referring to FIG. 17, each of pad wirings 190A-5, 190B-5 may includenotches NO-5 having a triangular shape in at least portion B-5 of thepad region. A third distance D3-5 between two adjacent notches NO-5 maybe smaller than a fourth distance D4-5 between two adjacent pad wirings190A-5, 190B-5. The pad wiring 190A-5, 190B-5 according to an exemplaryembodiment of the present invention described with reference to FIG. 17may include the notches, which arranged at relatively short intervals,of which sizes are relatively small compared to the pad wiring 190A-1,190B-1 described with reference to FIG. 13. Thus, the pad wirings190A-5, 190B-5 described with reference to FIG. 17 may have a relativelylarge line width in comparison with the pad wiring 190A-1, 190B-1described with reference to FIG. 13, thus increasing the efficiency ofelectrical signal transmission.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 13 through 17 describe that notches positionedat the first side and notches located at the second side of the padwiring on the pad region NR are symmetrical to each other with respectto the fourth direction D4 in which the pad wiring extends, thearrangement of the notches is not limited thereto. For example,referring to FIG. 18, pad wirings 190A-6, 190B-6 may include a pluralityof third notches NO1-6 positioned at the first side and a plurality ofsecond notches positioned at the second side on at least a portion B-6of pad region. The third notches NO1-6 need not overlap fourth notchesNO2-6 along a fifth direction D5 orthogonal to the fourth direction D4in a plan view. A third distance D3-6 between two adjacent third notchesNO1-6 (or between two adjacent fourth notches NO2-6) may be smaller thana fourth distance D4-6 between two adjacent pad wirings 190A-6, 190B-6.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 13 through 17 describe that notches of padwirings have at least one shape of the triangular shape, the rectangularshape, the trapezoidal shape, and the semicircular shape in the planview, shapes of the notches are not limited thereto. For example, thenotches may have other polygonal shapes. As an example, notches locatedat the first side of the pad wiring and notches located at the secondside of the pad wiring may have different shapes.

Although the exemplary embodiments of the present invention describedwith reference to FIGS. 13 through 17 describe that notches are arrangedat regular intervals in the pad region NR, the arrangement of thenotches is not limited thereto. In an exemplary embodiment of thepresent invention, the notches on the pad region NR may be arranged suchthat a distance between two adjacent notches increases as a distanceaway from the bending region BR increases.

FIGS. 19 through 20 are views for describing an effect of the displaydevice of FIG. 1.

Referring to FIGS. 19 through 20, notches may be formed in theconnection wirings on the bending region and the pad region, and aninterval between adjacent notches (e.g., a length of a straight portionof wiring) may be smaller than an interval between adjacent wirings,thus reducing or eliminating an occurrence of a short circuit betweenadjacent wirings on the bending region and the pad region during amanufacturing processes (e.g., processes before the connection wiring iscovered with the organic layer).

In an exemplary embodiment of the present invention described withreference to FIG. 19, when both sides of the connection wiring have astraight shape without a notch, a first particle T1, which is longerthan a distance between adjacent connection wirings, may be generatedduring the manufacturing process of the display device. A short circuitbetween the connection wirings may occur as a result of the firstparticle T1, and defects of display device may result. For example, in ahigh resolution display device, a gap between connection wirings may berelatively small, and the defects due to the short circuit may occur inthe bending region of the display device.

Referring to FIG. 20, in an exemplary embodiment of the presentinvention, notches may be formed in the connection wiring on the bendingregion such that both sides of the connection wiring do not extend in astraight line. In this case, although a second particle T2 may begenerated during the manufacturing process of the display device, thelength of the second particle T2 may be smaller than the distancebetween adjacent connection wirings. Thus, an occurrence of a shortcircuit between the connection wirings may be reduced or eliminated,thus increasing a manufacturing yield of the display device and reducinga manufacturing cost of the display device. For example, when thedisplay device having a quad high definition (Quad HD) resolution ismanufactured, the manufacturing yield may be increased by about 0.5%.

Thus, the display device according to an exemplary embodiment of thepresent invention may prevent a short circuit between adjacent wirings,such as in an exposed portion of wiring which is not covered by theorganic layer during the manufacturing process, by forming the notchesin the wirings. Although some exemplary embodiments of the presentinvention may include notches are formed in the connection wiringsand/or the pad wirings on the bending region or the pad region, notchesmay be formed at various locations in which the wiring is not coveredwith the organic layer or in which a short circuit can occur as a resultof an interaction between particles of adjacent wirings during amanufacturing process.

Although the exemplary embodiments of the present invention describethat notches are formed on both sides of each connection wiring and bothsides of each pad wiring, the notches may be formed on the connectionwirings and/or the pad wirings in various way. For one example, thenotches may be formed on some of the connection wirings, and the notchesmay not be formed on the others of the connection wirings and the padwirings. For another example, the notches may be formed on some of thepad wirings, and the notches may not be formed on the others of the padwirings and the connection wirings.

Although the display device according to example embodiments have beendescribed with reference to figures, those skilled in the art willreadily appreciate that many modifications are possible in the exampleembodiments without materially departing from the novel teachings andaspects of the present invention. For example, although the exampleembodiments describe that the display device may be the OLED device, atype of the display device is not limited thereto. Also, although theexample embodiments describe that the driving circuit may be mounted onthe substrate in a COP manner, the driving circuit can be mounted invarious manners.

Exemplary embodiments of the present invention may be applied to anelectronic device having the display device. For example, exemplaryembodiments of the present invention may be applied to a computermonitor, a laptop computer, a cellular phone, a smart phone, a smartpad, or a personal digital assistant (PDA).

While the present invention has been shown and described with referenceto the exemplary embodiments thereof, it will be apparent to those ofordinary skill in the art that various changes in form and detail may bemade thereto without departing from the spirit and scope of the presentinvention.

What is claimed is:
 1. A display device comprising: a substrateincluding a display region, a pad region spaced apart from the displayregion, and a bending region between the display region and the padregion; a plurality of pixel structures positioned in the display regionof the substrate; a plurality of pad wirings positioned in the padregion of the substrate; and a plurality of connection wiringselectrically connecting the pad wirings to the pixel structures, theconnection wirings including a plurality of notches in the bendingregion.
 2. The display device of claim 1, wherein a first distancebetween two adjacent notches of the plurality of notches is smaller thana second distance between two adjacent connection wirings of theplurality of connection wirings.
 3. The display device of claim 2,wherein each of the connection wirings further includes a plurality ofholes in the bending region.
 4. The display device of claim 3, wherein afirst length of the holes is smaller than the second distance.
 5. Thedisplay device of claim 3, wherein the connection wirings extend in afirst direction in the bending region, and wherein the holes are spacedapart from the notches along a second direction perpendicular to thefirst direction.
 6. The display device of claim 1, wherein the notchesinclude: a plurality of first notches positioned at a first side of eachof the connection wirings; and a plurality of second notches positionedat a second side of each of the connection wirings, the second sideopposite to the first side.
 7. The display device of claim 6, whereinthe connection wirings extend in a first direction in the bendingregion, and wherein the first notches are spaced apart from the secondnotches along a second direction perpendicular to the first direction.8. The display device of claim 6, wherein the connection wirings extendin a first direction in the bending region, and wherein respective firstnotches of the plurality of first notches are each substantially alignedwith a corresponding second notch of the plurality of second notchesalong a second direction.
 9. The display device of claim 1, wherein eachof the notches of the plurality of notches has an uneven shape whenviewed from a plan view.
 10. The display device of claim 1, wherein eachof the pad wirings includes: a plurality of third notches positioned ata first side of each of the pad wirings; and a plurality of fourthnotches positioned at a second side of each of the pad wirings, thefourth side opposite to the third side.
 11. The display device of claim10, wherein the pad wirings extend in a third direction, and wherein thethird notches of the plurality of third notches are spaced apart fromthe fourth notches of the plurality of fourth notches along a fourthdirection orthogonal to the third direction.
 12. The display device ofclaim 10, wherein the pad wirings extend in a third direction, andwherein respective third notches of the plurality of third notches areeach substantially aligned with corresponding fourth notches of theplurality of fourth notches along a fourth direction orthogonal to thethird direction.
 13. The display device of claim 1, wherein each of theconnection wirings includes: a first metal layer; a second metal layerdisposed on the first metal layer, the second metal layer includingaluminum (Al); and a third metal layer disposed on the second metallayer.
 14. The display device of claim 1, wherein the pixel structuresface away from the plurality of pad wirings when the substrate is bent.15. The display device of claim 1, further comprising: a protective filmpositioned under the display region and the pad region of the substrate;and an adhesive layer disposed between the substrate and the protectivefilm.
 16. The display device of claim 1, wherein the connection wiringsare configured to receive at least one of data signals, scan signals,emission control signals, or power voltages via the pad wirings.
 17. Adisplay device comprising: a substrate including a display region, a padregion spaced apart from the display region, and a bending regionbetween the display region and the pad region; a plurality of pixelstructures positioned in the display region of the substrate; a drivingcircuit positioned in the pad region of the substrate, wherein thedriving circuit is configured to provide a driving signal to the pixelstructures of the plurality of pixel structures; and a plurality ofconnection wirings electrically connecting the driving circuit to theplurality of pixel structures, the connection wirings including aplurality of notches in the bending region.
 18. The display device ofclaim 17, wherein a first distance between two adjacent notches of theplurality of notches is smaller than a second distance between twoadjacent connection wirings of the plurality of connection wirings. 19.The display device of claim 18, wherein each of the connection wiringsfurther includes a plurality of holes in the bending region.
 20. Thedisplay device of claim 19, wherein a first length of the holes issmaller than the second distance.
 21. The display device of claim 17,wherein the notches includes: a plurality of first notches positioned ata first side of each of the connection wirings; and a plurality ofsecond notches positioned at a second side of each of the connectionwirings, the second side opposite to the first side.
 22. The displaydevice of claim 17, wherein the connection wirings of the plurality ofconnection wirings are each connected to the driving circuit via atleast one pad wiring of a plurality of pad wirings positioned in the padregion.
 23. The display device of claim 22, wherein each of the padwirings includes: a plurality of third notches positioned at a firstside of each of the pad wirings in the pad region; and a plurality offourth notches positioned at a second side of each of the pad wirings inthe pad region, the fourth side opposite to the third side.
 24. Adisplay device comprising: a substrate including a display region and apad region spaced apart from the display region; a plurality of pixelstructures positioned in the display region of the substrate; aplurality of pad wirings positioned in the pad region of the substrate,the pad wirings including a plurality of first notches; and a pluralityof connection wirings electrically connecting the pad wirings to thepixel structures.
 25. A display device of claim 24, wherein a firstdistance between two adjacent first notches of the plurality of firstnotches is smaller than a second distance between two adjacent padwirings of the plurality of pad wirings.
 26. A display device of claim24, wherein the substrate further includes a bending region between thedisplay region and the pad region, and wherein each of the connectionwirings includes a plurality of holes in the bending region.
 27. Adisplay device of claim 26, wherein the connection wirings include aplurality of second notches in the bending region.